ICC harnesses the power of 3rd Gen AMD EPYC processors for engineering workloads


NORTHBROOK, Illinois, March 21, 2022 – International Computer Concepts (ICC), a leading systems integrator of enterprise computing solutions, announces the availability of high-performance systems featuring new 3rd Gen AMD EPYC processors with AMD 3D V-Cache technology that are optimized for engineering workloads such as Computational Fluid Dynamics (CFD), Computer Aided Engineering (CAE), and Electronic Design Automation (EDA).

Technical computing workloads depend on simulation-driven technologies that ingest and generate massive data sets. With these constantly growing data sets, there is a need for ever more powerful computing power. With industry-leading hardware, cloud orchestration software, and 3rd generation AMD EPYC processorsICC’s turnkey solutions are designed to maximize workload acceleration, increase both memory and performance, and reduce time to insights.

The world’s most powerful processors for technical computingii: AMD EPYC 7003 processors with AMD 3D V-Cache technology triple the amount of available L3 cache to 768MB per socket compared to the standard EPYC 7003 seriesiiihelping to achieve faster results for targeted workloads such as EDA, CFD and FEA software and solutions while providing socket compatibility with existing AMD EPYC 7003 platforms.IV By increasing the L3 cache pool, which has lower latency and is closer to the core than main memory, AMD EPYC 7003 processors with AMD 3D V-Cache utilize the same shared memory architecture as the rest of the 3rd generation EPYC family .generation. This means customers can now enjoy up to 96MB of L3 cache per CCD without sacrificing performance, even with fewer core counts and mainstream processors.

“3rd Gen AMD EPYC processors with AMD 3D V-Cache Technology once again raise the bar for breakthrough performance, accelerating critical product design and engineering workloads by vertically stacking L3 cache using our breakthrough packaging technology. This provides the performance and power efficiency required for critical, compute-intensive workloads and enables faster results,” said Ram Peddibhotla, corporate vice president, EPYC Product Management, AMD. “3rd Gen AMD EPYC processors with AMD 3D V-Cache technology are also socket-compatible with existing 3rd Gen EPYC platforms, enabling customers to get up and running quickly and achieve better business outcomes.”

“We are excited to launch a suite of new solutions optimized for the best performance and efficiency—specifically designed for our customers running technical computing workloads. Modern engineering applications running at scale rely heavily on HPC infrastructure. Our innovative turnkey cluster solutions, powered by AMD EPYC processors and our European counterpart Define Tech’s LMX Cloud Orchestration software, are designed to simplify HPC and AI adoption and provide excellent performance for all memory-bound applications and workloads,” adds Alexey, Development Lead at ICC Stolyar.

Learn more about our solution offering, including our turnkey cluster offering optimized for technical computing workloads and powered by 3rd Gen AMD EPYC processors with AMD 3D V-Cache technology click here.


I “Technical Computing” or “Technical Computing Workloads” as defined by AMD may include: electronic design automation, computational fluid dynamics, finite element analysis, seismic tomography, weather forecasting, quantum mechanics, climate research, molecular modeling, or similar workloads. GD-204
ii MLNX-032: World’s highest performance for comparing engineering calculations, based on AMD internal testing on 02/14/2022, measuring the score or jobs/day for each of the application test case simulations, the average acceleration on 2P servers at 32 -Core EPYC 7573X to 2P servers with Intel Xeon Platinum 8362 with 32 cores for peak performance per core and on 2P servers with top of stack 64 core EPYC 7773X to 2P servers with top of stack- 40-core Intel Xeon Platinum 8380 for power density guidance & results may vary based on factors such as silicon version, hardware and software configuration, and driver versions.

iii MLNX-12: EPYC 7003 processors with AMD 3D V-cache have 768 MB L3 cache, while EPYC 7003 processors without AMD 3D V-cache have up to 256 MB.

IV Processor compatibility with EPYC 7003 powered platforms may require a BIOS update.

About International Computer Concepts (ICC)

International Computer Concepts (ICC) is a leading provider of IT technology. Since 1993, ICC has been integrating computer systems with the latest hardware and software components to meet its customers’ ever-changing business and IT needs. With an emphasis on engineering expertise and providing energy efficient and high performance solutions, ICC uses only the best components available to design and assemble computer systems. Based in Northbrook, Illinois, ICC works closely with customers that include local businesses, multinationals, universities and government agencies to provide them with great computers.

Source: ICC


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